ADIN1300CCPZ-R7 datasheet(10/79 Pages) AD

10 / 79 page

ADIN1300

Data Sheet

Rev. 0 | Page 10 of 79

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 11.

Parameter

Rating

VDDIO to GND

−0.3 V to +3.63 V

DVDD_0P9 to GND

−0.3 V to +1.1 V

AVDD_3P3 to GND

−0.3 V to +3.63 V

MAC Interface to GND

−0.3 V to VDDIO +

0.3 V

LINK_ST, GP_CLK

−0.3 V to VDDIO +

0.3 V

MDIO, MDC, INT_N to GND

−0.3 V to +3.63 V

MDI_x_x to GND

−0.3 V to AVDD_3P3 +

0.3 V

LED_0, RESET_N, XTAL_I/CLK_IN/REF_CLK,

XTAL_O, CLK25_REF

−0.3 V to AVDD_3P3 +

0.3 V

Operating Temperature Range (TA)

Industrial

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ Maximum)

125°C

Power Dissipation

(TJ maximum − TA)/θJA

Lead Temperature

JEDEC industry-

standard

Soldering

J-STD-020

Electrostatic Discharge (ESD)

Human Body Model (HBM)

MDI_x_x Pins

4 kV

All Other Pins

2 kV

Machine Model (MM)

200 V

Field Induced Charged Device Model (FICDM)

1.25 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 12. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-40-26

451

251

°C/W

302

°C/W

Based on simulated data using a JEDEC 2s2p thermal test board with a 3 × 3

array of thermal vias in a JEDEC natural convection environment. See JEDEC

specification JESD-51 for details.

Test Condition 1: thermal impedance measured on Analog Devices, Inc.,

hardware, 2S2P with 4 × 4 via array.

ESD CAUTION

ADIN1300CCPZ-R7 Folha de dados(PDF) 10 Page - Analog Devices

ADIN1300CCPZ-R7 Folha de dados(HTML) 10 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79

Folha de dados Download

Ligação URL