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RA4L1 Folha de dados(PDF) 114 Page - Renesas Technology Corp |
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RA4L1 Folha de dados(HTML) 114 Page - Renesas Technology Corp |
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114 / 125 page ![]() 5 4 3 2 H D C B A 1 (NSMD) (Solder Mask) Seating Plane (Back Side Coating) 3.644 ±0.05 A1 Ball Area TOP VIEW 0.40 BOTTOM VIEW 0.50 ±0.05 0.20 ±0.025 0.265 ±0.025 C 0.05 C SIDE VIEW Package Outline 0.316 0.216 0.422 0.541 NOTES: 1. JEDEC compatible. 2. All dimensions are in mm and angles are in degrees. 3. Use ±0.05 mm for the non-toleranced dimensions. 4. Numbers in ( ) are for references only. 5. Pre-reflow solder ball diameter is Ø0.25 mm. 6. UBM diameter is Ø0.24 mm. (0.025) 4.282 ±0.05 (PCB Top View, NSMD Design) RECOMMENDED LAND PATTERN 0.40 E F G 6 7 8 9 A1 Ball Indicator © Renesas Electronics Corporation 外形図 Outline drawing Renesasコード SUBG0072LB-A ルネサスエレクトロニクス株式会社 Renesas Electronics Corporation RDK-G-001838 1/1 JEITA Package code RENESAS code MASS(TYP.)[g] S-UFBGA72-4.28x3.64-0.40 SUBG0072LB-A 0.02 Figure A2.3 WLCSP 72-pin RA4L1 Datasheet Appendix 2. Package Dimensions R01DS0447EJ0131 Rev.1.31 May 26, 2026 Page 114 of 125 |
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