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ADIN1300BCPZ-R7 Folha de dados(PDF) 8 Page - Analog Devices

Nome de Peças ADIN1300BCPZ-R7
Descrição Electrónicos  Robust, Industrial, Low Latency and Low Power 10 Mbps, 100 Mbps, and 1 Gbps Ethernet PHY
PDF  96 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADIN1300BCPZ-R7 Folha de dados(HTML) 8 Page - Analog Devices

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Data Sheet
ADIN1300
SPECIFICATIONS
analog.com
Rev. B | 8 of 96
Table 1. (Continued)
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Clock Input Frequency (CLK_IN)
25
MHz
Requirements for external clock applied to XTAL_I pin, MII,
RGMII modes
50
MHz
RMII mode
Clock Input Voltage Range (CLK_IN)
1.62
3.63
V
1 MAC interface capacitive load of 5 pF, REFCLK is disabled.
2 The DPTH_MII_BYTE register defines whether the programmed transmit first in, first out (FIFO) depth is bytes or nibbles for MII modes (10BASE-Te and 100BASE-TX).
The register defaults to 1, which corresponds to bytes. In 10BASE-Te and 100BASE-TX, because the MAC-PHY interface is nibble based, the internal prefill in the transmit
FIFO is larger and is observed as longer latency times. The latency specifications in Table 1 have this bit set to 0.
3 This 100BASE-TX RGMII transmit latency is where the transmit FIFO is programmed for synchronous operation (MAC transmit clock must be synchronous with the
ADIN1300 reference clock), see the FIFO_SYNC register.
4 This 100BASE-TX RGMII transmit latency is where the MAC transmit clock does not have to be synchronous with the ADIN1300 reference clock and the transmit FIFO
takes care of any phase difference.
5 The RMII transmit latency depends on the phase relationship between the 50 MHz reference clock and the internal 25 MHz clock. The transmit latency is fixed for a given
link.
6 Where load capacitance (CL) = ((C1 × C2)/(C1 + C2) + CSTRAY), where CSTRAY is the stray capacitance including routing and package parasitics.
TIMING CHARACTERISTICS
Rise and fall time specifications are defined from 10% to 90%, unless otherwise noted.
Power-Up Timing
Table 2. Power-Up Timing
Parameter
Description
Min
Typ
Max
Unit
tRAMP
Power supply ramp time
40
ms
t1
Minimum time interval to internal power good1
6.8
ms
t2
XTAL_I crystal settling time
1.5
2
ms
XTAL_I external clock settling time
20
μs
t3
Hardware configuration latch time
64
μs
t4
Management interface active
5
ms
1 The minimum time interval is referenced to the last supply to reach its rising threshold. There is no specific power supply sequencing required.
Figure 2. Power-Up Timing



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