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TPS6521825 Folha de dados(PDF) 98 Page - Texas Instruments |
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TPS6521825 Folha de dados(HTML) 98 Page - Texas Instruments |
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98 / 109 page ![]() Thermal Pad IN Via to Ground Plane Via to Internal Plane Input Bypass Capacitor Output Filter Capacitor VOUT 98 TPS6521825 SLDS260 – NOVEMBER 2019 www.ti.com Submit Documentation Feedback Product Folder Links: TPS6521825 Layout Copyright © 2019, Texas Instruments Incorporated 7 Power Supply Recommendations The device is designed to operate with an input voltage supply range between 2.7 V and 5.5 V. This input supply can be from a single cell Li-Ion battery or other externally regulated supply. If the input supply is located more than a few inches from the TPS6521825 additional bulk capacitance may be required in addition to the ceramic bypass capacitors. An electrolytic capacitor with a value of 47 µF is a typical choice. The coin cell back up input is designed to operate with a input voltage supply between 2.2 V and 3.3 V This input should be supplied by a coin cell battery with 3-V nominal voltage. 8 Layout 8.1 Layout Guidelines Follow these layout guidelines: • The IN_X pins should be bypassed to ground with a low ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 4.7-µF with a X5R or X7R dielectric. • The optimum placement is closest to the IN_X pins of the device. Take care to minimize the loop area formed by the bypass capacitor connection, the IN_X pin, and the thermal pad of the device. • The thermal pad should be tied to the PCB ground plane with a minimum of 25 vias. See Figure 8-2 for an example. • The LX trace should be kept on the PCB top layer and free of any vias. • The FBX traces should be routed away from any potential noise source to avoid coupling. • DCDC4 Output capacitance should be placed immediately at the DCDC4 pin. Excessive distance between the capacitance and DCDC4 pin may cause poor converter performance. 8.2 Layout Example Figure 8-1. Layout Recommendation |
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