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TPS6521825 Folha de dados(PDF) 98 Page - Texas Instruments

Nome de Peças TPS6521825
Descrição Electrónicos  TPS6521825 Power Management IC (PMIC) for NXP i.MX 8M Mini
PDF  109 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

TPS6521825 Folha de dados(HTML) 98 Page - Texas Instruments

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Thermal
Pad
IN
Via to Ground Plane
Via to Internal Plane
Input Bypass
Capacitor
Output Filter
Capacitor
VOUT
98
TPS6521825
SLDS260 – NOVEMBER 2019
www.ti.com
Submit Documentation Feedback
Product Folder Links: TPS6521825
Layout
Copyright © 2019, Texas Instruments Incorporated
7
Power Supply Recommendations
The device is designed to operate with an input voltage supply range between 2.7 V and 5.5 V. This input
supply can be from a single cell Li-Ion battery or other externally regulated supply. If the input supply is
located more than a few inches from the TPS6521825 additional bulk capacitance may be required in
addition to the ceramic bypass capacitors. An electrolytic capacitor with a value of 47 µF is a typical
choice.
The coin cell back up input is designed to operate with a input voltage supply between 2.2 V and 3.3 V
This input should be supplied by a coin cell battery with 3-V nominal voltage.
8
Layout
8.1
Layout Guidelines
Follow these layout guidelines:
The IN_X pins should be bypassed to ground with a low ESR ceramic bypass capacitor. The typical
recommended bypass capacitance is 4.7-µF with a X5R or X7R dielectric.
The optimum placement is closest to the IN_X pins of the device. Take care to minimize the loop area
formed by the bypass capacitor connection, the IN_X pin, and the thermal pad of the device.
The thermal pad should be tied to the PCB ground plane with a minimum of 25 vias. See Figure 8-2 for
an example.
The LX trace should be kept on the PCB top layer and free of any vias.
The FBX traces should be routed away from any potential noise source to avoid coupling.
DCDC4 Output capacitance should be placed immediately at the DCDC4 pin. Excessive distance
between the capacitance and DCDC4 pin may cause poor converter performance.
8.2
Layout Example
Figure 8-1. Layout Recommendation



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