GD32H757ZMT7 datasheet(10/151 Pages) GIGADEVICE

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GD32H757xx Datasheet

General description

The GD32H757xx device belongs to the high performance line of GD32 MCU family. It is a

new 32-bit general-purpose microcontroller based on the Arm® Cortex®-M7 core with best

cost-performance ratio in terms of enhanced processing capacity, reduced power

consumption and peripheral set. The Arm® Cortex®-M7 processor is a highly efficient high-

performance, embedded processor that features low interrupt latency, low-cost debug, and

has backwards compatibility with existing Cortex-M profile processors. The processor has an

in-order super-scalar pipeline that means many instructions can be dual-issued, including

load/load and load/store instruction pairs because of multiple memory interfaces. The Cortex-

M7 is a high-performance processor, which features a 6-stage superscalar pipeline with

branch prediction and an optional FPU capable of single-precision and optionally double-

precision operations. The instruction and data buses have been enlarged to 64-bit wide over

the previous 32-bit buses. It also provides a Memory Protection Unit (MPU) and powerful

trace technology for enhanced application security and advanced debug support.

The GD32H757xx device incorporates the Arm® Cortex®-M7 32-bit processor core operating

at 600 MHz frequency with Flash security protection to prevent illegal code/data access. It

provides up to 3840 KB on-chip Flash memory, 512KB AXI SRAM and 512KB RAM shared

(ITCM/DTCM/AXI) memory. An extensive range of enhanced I/Os and peripherals connected

to four APB buses. The devices offer up to two 14-bit 4 MSPS ADCs, a 12 bit 5.3 MSPS ADC,

a 12-bit DAC, up to twelve general 16-bit timers, two 16-bit PWM advanced timers, four 32-

bit general timers, and four 16-bit basic timers, as well as standard and advanced

communication interfaces: up to six SPIs, two OSPIs, four I2Cs, four USARTs and four

UARTs, four I2Ss, three CAN-FDs, a USBHS, a ENET, two SDIOs and a MDIO. Additional

peripherals as digital camera interface (DCI), EXMC interface with SDRAM extension support,

TFT-LCD Interface (TLI), Image Processing Accelerator (IPA), Serial Audio Interface (SAI),

Receiver of Sony/Philips Digtial Interface (RSPDIF), Filter arithmetic accelerator (FAC), Real-

time decryption (RTDEC) and high performance digital filter module (HPDF) are included.

The device operates from a 1.71V to 3.6V power supply and available in

–40 to +85 °C

temperature range for grade 6 devices, -40 to +105 °C temperature range for grade 7 devices.

Three power saving modes provide the flexibility for maximum optimization of power

consumption, an especially important consideration in low power applications.

The above features make GD32H757xx devices suitable for a wide range of interconnection

and advanced applications, especially in areas such as industrial control, consumer and

handheld equipment, embedded modules, human machine interface, security and alarm

systems, energy storage system, graphic display, audio player, automotive navigation, drone,

IoT and so on.

GD32H757ZMT7 Folha de dados(PDF) 10 Page - GigaDevice Semiconductor (Beijing) Inc.