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GD32H757ZMT7 Folha de dados(PDF) 9 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD32H757ZMT7 Folha de dados(HTML) 9 Page - GigaDevice Semiconductor (Beijing) Inc. |
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9 / 151 page ![]() GD32H757xx Datasheet 8 Table 4-71. Asynchronous non-multiplexed SRAM / PSRAM / NOR read timings(1)(2)...................... 132 Table 4-72. Asynchronous non-multiplexed SRAM / PSRAM / NOR write timings(1)(2) ..................... 133 Table 4-73. Asynchronous multiplexed PSRAM / NOR read timings(1)(2) ........................................... 133 Table 4-74. Asynchronous multiplexed PSRAM / NOR write timings(1)(2) .......................................... 134 Table 4-75. Synchronous multiplexed PSRAM / NOR read timings(1)(2) ............................................. 134 Table 4-76. Synchronous multiplexed PSRAM write timings(1)(2)........................................................ 134 Table 4-77. Synchronous non-multiplexed PSRAM / NOR read timings(1)(2)...................................... 135 Table 4-78. Synchronous non-multiplexed PSRAM write timings(1)(2)................................................ 135 Table 4-79. SDRAM read timings ........................................................................................................... 136 Table 4-80. TIMER characteristics(1) ...................................................................................................... 136 Table 4-81. DCI characteristics(1) ........................................................................................................... 137 Table 4-82. FWDGT min/max timeout period at 32 kHz (IRC32K) (1) ................................................... 138 Table 4-83. WWDGT min-max timeout value at 50 MHz (fPCLK1) (1) ...................................................... 138 Table 5-1. LQFP144 package dimensions ............................................................................................. 139 Table 5-2. BGA100 package dimensions .............................................................................................. 141 Table 5-3. LQFP100 package dimensions ............................................................................................. 143 Table 5-4. Package thermal characteristics(1) ....................................................................................... 145 Table 6-1. Part ordering code for GD32H757xx devices...................................................................... 147 Table 7-1. Revision history ..................................................................................................................... 148 |
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