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GD32H757ZMT7 Folha de dados(PDF) 7 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD32H757ZMT7 Folha de dados(HTML) 7 Page - GigaDevice Semiconductor (Beijing) Inc. |
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7 / 151 page ![]() GD32H757xx Datasheet 6 List of Tables Table 2-1. GD32H757xx devices features and peripheral list ............................................................... 10 Table 2-2. GD32H757xx memory map ..................................................................................................... 15 Table 2-3. GD32H757Zx LQFP144 pin definitions .................................................................................. 25 Table 2-4. GD32H757Vx LQFP100 pin definitions .................................................................................. 37 Table 2-5. GD32H757Vx BGA100 pin definitions.................................................................................... 45 Table 2-6. Port A alternate functions summary...................................................................................... 54 Table 2-7. Port B alternate functions summary...................................................................................... 55 Table 2-8. Port C alternate functions summary...................................................................................... 56 Table 2-9. Port D alternate functions summary...................................................................................... 57 Table 2-10. Port E alternate functions summary .................................................................................... 58 Table 2-11. Port F alternate functions summary .................................................................................... 59 Table 2-12. Port G alternate functions summary.................................................................................... 60 Table 2-13. Port H alternate functions summary .................................................................................... 60 Table 4-1. Abbreviations ........................................................................................................................... 84 Table 4-2. Absolute maximum ratings(1)(4) ............................................................................................... 85 Table 4-3. DC operating conditions ......................................................................................................... 85 Table 4-4. Vcore operating conditions(1)(2)(3)............................................................................................ 87 Table 4-5. Clock frequency(1)(2) ................................................................................................................. 87 Table 4-6. TCM interface frequency(1) ...................................................................................................... 88 Table 4-7. Operating conditions at Power up / Power down(1) .............................................................. 88 Table 4-8. Power consumption characteristics(1)(2)(3)(4) .......................................................................... 88 Table 4-9. System level ESD and EFT characteristics(1) ........................................................................ 92 Table 4-10. EMI characteristics(1) ............................................................................................................. 92 Table 4-11. Component level ESD characteristics(1) .............................................................................. 93 Table 4-12. Latch-up characteristics(1) .................................................................................................... 93 Table 4-13. Power supply supervisor characteristics............................................................................ 93 Table 4-14. USB regulator characteristics .............................................................................................. 95 Table 4-15. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics(4) ..................................................................................................................................................................... 95 Table 4-16. High speed external clock characteristics (HXTAL in bypass mode) .............................. 96 Table 4-17. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics(5) 96 Table 4-18. Low speed external user clock characteristics (LXTAL in bypass mode)....................... 97 Table 4-19. High speed internal clock (IRC48M) characteristics .......................................................... 99 Table 4-20. High speed internal clock (IRC64M) characteristics ........................................................ 100 Table 4-21. Low power internal clock (LPIRC4M) characteristics ...................................................... 101 Table 4-22. Low speed internal clock (IRC32K) characteristics ......................................................... 101 Table 4-23. PLL0/1/2 characteristics (wide VCO frequency range) .................................................... 101 Table 4-24. PLL0/1/2 characteristics (narrow VCO frequency range) ................................................ 102 Table 4-25. PLLUSBHS0/1 characteristics(3) ......................................................................................... 103 Table 4-26. Flash memory characteristics ............................................................................................ 103 |
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