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GD32H757ZMT7 Folha de dados(PDF) 4 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD32H757ZMT7 Folha de dados(HTML) 4 Page - GigaDevice Semiconductor (Beijing) Inc. |
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4 / 151 page ![]() GD32H757xx Datasheet 3 3.47. Debug mode ........................................................................................................... 82 3.48. Package and operation temperature..................................................................... 82 4. Electrical characteristics....................................................................................... 84 4.1. Absolute maximum ratings ................................................................................... 84 4.2. Recommended DC characteristics ....................................................................... 85 4.3. Power consumption ............................................................................................... 88 4.4. EMC characteristics ............................................................................................... 91 4.5. Power supply supervisor characteristics ............................................................. 93 4.6. Embedded USB regulator characteristics ............................................................ 95 4.7. External clock characteristics ............................................................................... 95 4.8. Internal clock characteristics ................................................................................ 99 4.9. PLL characteristics .............................................................................................. 101 4.10. Memory characteristics ....................................................................................... 103 4.11. NRST pin characteristics ..................................................................................... 103 4.12. GPIO characteristics ............................................................................................ 104 4.13. 14-bit ADC characteristics................................................................................... 107 4.14. 12-bit ADC characteristics.................................................................................... 110 4.15. High-precision temperature sensor characteristics ........................................... 115 4.16. Temperature sensor characteristics .................................................................... 116 4.17. Low power digital temperature sensor characteristics ...................................... 116 4.18. Voltage reference buffer characteristics ............................................................. 116 4.19. CMP characteristics .............................................................................................. 118 4.20. Temperature and VBAT monitoring ..................................................................... 119 4.21. DAC characteristics .............................................................................................. 119 4.22. I2C characteristics ............................................................................................... 122 4.23. SPI characteristics ............................................................................................... 123 4.24. OSPI characteristics ............................................................................................ 124 4.25. CPDM characteristics .......................................................................................... 126 4.26. HPDF characteristics ........................................................................................... 126 4.27. SAI characteristics ............................................................................................... 127 4.28. I2S characteristics................................................................................................ 128 4.29. USART characteristics......................................................................................... 129 |
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