AD6677 datasheet(10/48 Pages) AD

10 / 48 page

AD6677

Data Sheet

Rev. C | Page 10 of 48

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +2.0 V

DVDD to DGND

−0.3 V to +2.0 V

VIN+, VIN− to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

RFCLK to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CS, PDWN to DGND

−0.3 V to DVDD + 0.3 V

SCLK to DGND

−0.3 V to DVDD + 0.3 V

SDIO to DGND

−0.3 V to DVDD + 0.3 V

RST to DGND

−0.3 V to DVDD + 0.3 V

FD to DGND

−0.3 V to DVDD + 0.3 V

SERDOUT0+, SERDOUT0− to AGND

−0.3 V to DRVDD + 0.3 V

SYNCINB+, SYNCINB− to DGND

−0.3 V to DVDD + 0.3 V

SYSREF+, SYSREF− to AGND

−0.3 V to AVDD + 0.3 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

The exposed pad must be soldered to the ground plane of the

LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

PackageType

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3,4

θJB1,4,5

Unit

32-Lead LFCSP

5 mm × 5 mm

(CP-32-12)

37.1

3.1

20.7

°C/W

1.0

32.4

N/A

°C/W

2.5

29.1

N/A

°C/W

Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per MIL-STD-883, Method 1012.1.

N/A means not applicable.

Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane. As shown in Table 7, airflow increases

heat dissipation, which reduces θJA. In addition, metal in direct

contact with the package leads from metal traces, through holes,

ground, and power planes reduces the θJA.

ESD CAUTION

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