UCD3138064ARGCR.A datasheet(11/84 Pages) TI2

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UCD3138064A

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SLUSCA5B – DECEMBER 2015 – REVISED JANUARY 2017

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Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommend Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Referenced to DGND

Specifications

5.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

V33D

V33D to DGND

–0.3

3.8

V33DIO

V33DIO to DGND

–0.3

3.8

V33A

V33A to AGND

–0.3

3.8

BP18

BP18 to DGND

–0.3

2.5

Ground difference

|DGND – AGND|

0.3

All Pins, excluding AGND (2)

Voltage applied to any pin

–0.3

3.8

Junction Temperature, TJ

–40

125

°C

Storage temperature, Tstg

–55

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible if necessary precautions are taken.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible if necessary precautions are taken.

5.2

ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-

001 (1)

±2000

Charged-device model (CDM), per JEDEC specification

JESD22-C101 (2)

±500

5.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

V33D

Digital power

3.3

3.6

V33DIO

Digital I/O power

3.3

3.6

V33A

Analog power

3.3

3.6

BP18

1.8-V digital power

1.6

1.8

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.4

Thermal Information

THERMAL METRIC (1)

UCD3138064A

UNIT

VQFN (RGC)

64 PINS

RθJA

Junction-to-ambient thermal resistance

19.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

5.7

°C/W

RθJB

Junction-to-board thermal resistance

3.1

°C/W

ψJT

Junction-to-top characterization parameter

0.1

°C/W

ψJB

Junction-to-board characterization parameter

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.3

°C/W

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