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ADIN1101CCPZ-R7 Folha de dados(PDF) 37 Page - Analog Devices

Nome de Peças ADIN1101CCPZ-R7
Descrição Electrónicos  Robust, Industrial, Low Power 10BASE-T1L PHY
PDF  79 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADIN1101CCPZ-R7 Folha de dados(HTML) 37 Page - Analog Devices

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Data Sheet
ADIN1101
APPLICATIONS INFORMATION
analog.com
Rev. A | 37 of 79
Figure 30. External 50 MHz Clock Input Circuit for RMII Mode
For 0.8 V ≤ VS p-p ≤ 1 V (dc coupling), the following results:
C1 = 50 Ω (replace capacitor with resistor)
C2 not required
For VS p-p > 1.0 V (ac coupling) and C1 and C2 being close to the
ADIN1101 XTAL_I/CLK_IN pin, the following results:
C1 = 70 pF maximum
C2 = 10 pF
CPIN = 3 pF (ADIN1101 pin capacitance)
CSTRAY2 ~ 0 pF
VS p-p – VCLK_IN p-p > 0.2 V
C1 = VCLK_IN×C2+CSTRAY2+CPIN
Vs−VCLK_IN
Table 32. C1 and C2 Values for Different VS p-p Values with VCLK_IN = 1 V p-p
VS V p-p
C2 (pF)
C1
1.0
Not applicable
50 Ω
1.2
10
68 pF
1.8
10
18 pF
2.2
10
12 pF
2.5
10
10 pF
2.8
10
8.2 pF
3.0
10
8.2 pF
3.3
10
8.2 pF
The capacitor tolerance from the manufacturer must be included
in the calculations to provide reasonable margin with regard to the
VCLK_IN target voltage.
Note that additional filtering can be required for the external MAC
module. The selected clock source must be able to supply the
current required by the circuit.
PCB Parasitic Capacitance Considerations
The parasitic capacitance of the clock traces can have a nonnegligi-
ble impact on the signal. The PCB stack and the trace impedance
must be selected carefully to reduce parasitic impedance and pro-
vide the best timing performance, especially if the RMII is selected
(50 MHz clock).
Considering the ac coupling RMII scenario described in the Exter-
nal 50 MHz Clock Input for RMII Mode section, Table 33 displays
some basic calculations of the PCB parasitic capacitance using the
following PCB parameters:
Transmit line type: Microstrip layer 1/2
Clock trace width: W = 127 μm (5 mils)
PCB L1 copper foil thickness after plating: T = 35 μm (1.38 mils)
L1 to L2 ground plane distance: H = 0.116 mm (4.55 mils)
Substrate relative permittivity: εr = 4.6 (FR4)
In addition, see the IPC-2141 standard for models and guidelines.
Table 33. Trace Parasitic Capacitance Examples
Total Clock Trace Length (cm)
Clock Trace Stray Capacitance (pF)
1
~1
2
~2
5
~5
ELECTROMAGNETIC COMPATIBILITY (EMC)
AND ELECTROMAGNETIC IMMUNITY (EMI)
The ADIN1101 was tested at the system level for EMC and EMI.
Table 34 summarizes the results.
Table 34. EMC/EMI Tests Conducted on ADIN1101 at System Level
EMC/EMI Test
Withstand Threshold/Class
IEC 61000-4-4 EFT
±4 kV
IEC 61000-4-2 ESD (Contact Discharge)
±4 kV
IEC 61000-4-2 ESD (Air Discharge)
±8 kV
IEC 61000-4-5 Surge
±4 kV
IEC 61000-4-6 Conducted Immunity
10 V/m
IEC 61000-4-3 Radiated Immunity
Class A
EN 55032 Radiated Emissions
Class B



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