ADIN2111BCPZ-R7 datasheet(9/129 Pages) AD

9 / 129 page

Data Sheet

ADIN2111

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. A | 9 of 129

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

VDDIO to GND

−0.3 V to +4 V

DVDD1_1P1, DVDD2_1P1, DLDO1_1P1,

DLDO2_1P1, to GND

−0.3 V to +1.35 V

AVDD_H, AVDD_L to GND

−0.3 V to +4 V

SPI1, INT to GND

−0.3 V to VDDIO + 0.3 V

P1_TXN, P1_TXP, P2_TXN, P2_TXP to

GND

−0.3 V to AVDD + 0.3 V

P1_LED_0, P2_LED_0, P1_LED_1,

P2_LED_1, RESET to GND

−0.3 V to VDDIO + 0.3 V

XTAL_I/CLK_IN to GND

−0.3 V to 2.75 V

XTAL_O, CLK25_REF to GND

−0.3 V to 1.35 V

Operating Temperature Range (TA)

Industrial

−40°C to +85°C

Extended

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ Maximum)

125°C

Power Dissipation

(TJ maximum − TA)/θJA

Lead Temperature

JEDEC industry standard

Soldering

J-STD-020

1 See the Pin Configuration and Function Descriptions section for a full list of SPI

pins.

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this specification

is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

Table 6. Thermal Resistance

Package Type

θJA1

Unit

CP-48-132

°C/W

1 θJA is specified for the worst-case conditions, that is, a device soldered in a

circuit board for surface-mount packages.

2 Test Condition 1: thermal impedance simulated values are based on a JE-

DEC 2S2P thermal test board with thermal vias. See JEDEC JESD51.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for ADIN2111

Table 7. ADIN2111, 48-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

P1_TXN, P1_TXP, P2_TXN,

P2_TXP Pins

8000

All Other Pins

2000

FICDM

1250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

ADIN2111BCPZ-R7 Folha de dados(PDF) 9 Page - Analog Devices

ADIN2111BCPZ-R7 Folha de dados(HTML) 9 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Folha de dados Download

Ligação URL