TUSB8042AI datasheet(10/64 Pages) TI2

10 / 64 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

range

VDD Supply voltage range

–0.3

1.4

VDD33 Supply voltage range

–0.3

3.8

Voltage range

USB_SSRXP_UP, USB_SSRXN_UP, SSRXP_DN[4:1],

USB_RXN_DP[4:1] and USB_VBUS terminals

–0.3

1.4

XI terminal

–0.3

2.45

All other terminals

–0.3

3.8

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum

Ratings do not imply functional operation of the device at these or any other conditions beyond those listed

under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within

the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,

functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

1.1V Supply voltage

0.99

1.1

1.26

VDD33

3.3V Supply voltage

3.0

3.3

3.6

USB_VBU

Voltage at USB_VBUS terminal.

1.155

TUSB8042A Ambient temperature

°C

TUSB8042AI Ambient temperature

–40

°C

Junction temperature

–40

105

°C

6.4 Thermal Information

THERMAL METRIC(1)

TUSB8042A

UNIT

RGC

64 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

11.5

°C/W

RθJB

Junction-to-board thermal resistance

5.3

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

5.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TUSB8042A

SLLSF93A – JUNE 2019 – REVISED JANUARY 2025

www.ti.com

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