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5228-DS05-R Folha de dados(PDF) 91 Page - Broadcom Corporation. |
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5228-DS05-R Folha de dados(HTML) 91 Page - Broadcom Corporation. |
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91 / 100 page ![]() Data Sheet BCM5228 7/12/04 Broa d c om Co rp o r a t i o n Document 5228-DS09-405-R Mechanical Information Page 79 Figure 13: 256-Pin Fine Pitch BGA (FPBGA) Package TOP VIEW A1 BALL PAD CORNER C0.20 M SIDE VIEW 6 SEATING PLANE X ZY Ø0.50 TYP 5 X 1.45P0.10 0.40P0.05 17.00 C0.08 M Z 1.05P0.05 0.10 4X 0.15 Z Z 0.20 Z BOTTOM VIEW (256 SOLDER BALLS) 1 A1 BALL PAD CORNER 1.00 B D C E 2 3 4 5 1.00 REF A 10 9 876 K J H G F 11 12 M L T P R 16 15 13 14 5 DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM Z. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 256. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 16 X 16. THE BASIC SOLDER BALL GRID PITCH IS 1.00. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M-1994. 4. 3. 2. 1. PRIMARY DATUM Z AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 6 N |
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