SPC564A70B4 datasheet(76/133 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC564A70B4, SPC564A70L7

76/133

Doc ID 18078 Rev 4

3.4

EMI (electromagnetic interference) characteristics

3.5

Electrostatic discharge (ESD) characteristics

Table 13.

EMI testing specifications(1)

Symbol

Parameter

Conditions

fOSC/fBUS

Frequency

Level

(max)

Unit

VRE_TEM

Radiated emissions,

electric field

VDD =5.25 V;

TA =+25 °C

150 kHz–30 MHz —

RBW 9 kHz, step size

5kHz

30 MHz–1 GHz —

RBW 120 kHz, step

size 80 kHz

16 MHz crystal

40 MHz bus

No PLL frequency

modulation

150 kHz–50 MHz

dBµV

50–150 MHz

150–500 MHz

500–1000 MHz

IEC Level

—

SAE Level

—

16 MHz crystal

40 MHz bus

±2% PLL frequency

modulation

150 kHz–50 MHz

dBµV

50–150 MHz

150–500 MHz

500–1000 MHz

IEC Level

—

SAE Level

—

EMI testing and I/O port waveforms per standard IEC 61967-2.

Table 14.

ESD ratings(1)(2)

Symbol

Parameter

Conditions

Value

Unit

—

ESD for Human Body Model (HBM)

—

2000

HBM circuit description

—

1500

CSR

—100

—

ESD for Field Induced Charge Model (FDCM)

All pins

500

Corner pins

750

—

Number of pulses per pin

Positive pulses (HBM)

—

Negative pulses (HBM)

—

Number of pulses

—

All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.

Device failure is defined as: “If after exposure to ESD pulses, the device does not meet the device specification

requirements, which includes the complete DC parametric and functional testing at room temperature and hot

temperature.”

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