SPC564A70B4 datasheet(72/133 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC564A70B4, SPC564A70L7

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Doc ID 18078 Rev 4

3.3

Thermal characteristics

Table 10.

Thermal characteristics for 176-pin LQFP(1)

Symbol

Parameter

Conditions

Value Unit

RθJA CC D Junction-to-ambient, natural convection

(2)

Single-layer board – 1s

°C/W

RθJA CC D Junction-to-ambient, natural convection

(2)

Four-layer board – 2s2p

°C/W

RθJMA

CC D

Junction-to-moving-air, ambient(2)

at 200 ft./min., single-layer board – 1s

°C/W

CC D

at 200 ft./min., four-layer board – 2s2p

°C/W

RθJB CC D Junction-to-board

(3)

°C/W

RθJCtop CC D Junction-to-case

(4)

5°C/W

ΨJT CC D

Junction-to-package top, natural

convection(5)

2°C/W

Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package.

Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Table 11.

Thermal characteristics for 208-pin LBGA(1)(2)

Symbol

Parameter

Conditions

Value Unit

RθJA

CC D

Junction-to-ambient, natural convection(3)

Single layer board – 1s(4)

°C/W

CC D

Four layer board – 2s2p(5)

°C/W

RθJMA

CC D

Junction-to-moving-air, ambient(3)

at 200 ft./min., single-layer board – 1s(5)

°C/W

CC D

at 200 ft./min., four-layer board – 2s2p

°C/W

RθJB CC D Junction-to-board

(6)

Four-layer board – 2s2p

°C/W

RθJC CC D Junction-to-case

(7)

6°C/W

ΨJT CC D Junction-to-package top natural convection(8)

2°C/W

Thermal characteristics are targets based on simulation that are subject to change per device characterization.

LBGA208 is available upon specific request. Please contact your ST sales office for details.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal

Per JEDEC JESD51-6 with the board horizontal

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

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