CC1150-RTR1 datasheet(4/67 Pages) TI

4 / 67 page

CC1150

SWRS037A

Page 4 of 60

RADIO CONTROL ................................................................................................................................30

16.1

POWER ON START-UP SEQUENCE........................................................................................................31

16.2

CRYSTAL CONTROL............................................................................................................................31

16.3

VOLTAGE REGULATOR CONTROL.......................................................................................................32

16.4

ACTIVE MODE ....................................................................................................................................32

16.5

TIMING ...............................................................................................................................................32

DATA FIFO ........................................................................................................................................33

FREQUENCY PROGRAMMING ..............................................................................................................34

VCO...................................................................................................................................................34

19.1

VCO AND PLL SELF-CALIBRATION ...................................................................................................34

VOLTAGE REGULATORS .....................................................................................................................35

OUTPUT POWER PROGRAMMING ........................................................................................................35

21.1

SHAPING AND PA RAMPING ...............................................................................................................36

GENERAL PURPOSE / TEST OUTPUT CONTROL PINS ...........................................................................37

ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION ................................................................39

23.1

ASYNCHRONOUS SERIAL OPERATION.................................................................................................39

23.2

SYNCHRONOUS SERIAL OPERATION ...................................................................................................39

SYSTEM CONSIDERATIONS AND GUIDELINES ......................................................................................39

24.1

SRD REGULATIONS............................................................................................................................39

24.2

FREQUENCY HOPPING AND MULTI-CHANNEL SYSTEMS.....................................................................40

24.3

WIDEBAND MODULATION NOT USING SPREAD SPECTRUM.................................................................40

24.4

DATA BURST TRANSMISSIONS............................................................................................................41

24.5

CONTINUOUS TRANSMISSIONS ...........................................................................................................41

24.6

LOW COST SYSTEMS ..........................................................................................................................41

24.7

BATTERY OPERATED SYSTEMS ..........................................................................................................41

24.8

INCREASING OUTPUT POWER .............................................................................................................41

CONFIGURATION REGISTERS ..............................................................................................................42

25.1

CONFIGURATION REGISTER DETAILS .................................................................................................45

25.2

STATUS REGISTER DETAILS.................................................................................................................55

PACKAGE DESCRIPTION (QLP 16) ......................................................................................................57

26.1

RECOMMENDED PCB LAYOUT FOR PACKAGE (QLP 16) .....................................................................57

26.2

SOLDERING INFORMATION..................................................................................................................57

REFERENCES.......................................................................................................................................58

GENERAL INFORMATION ....................................................................................................................59

28.1

DOCUMENT HISTORY .........................................................................................................................59

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