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OPTION_REG Folha de dados(PDF) 14 Page - Microchip Technology

Nome de Peças OPTION_REG
Descrição Electrónicos  Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver
PDF  222 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

OPTION_REG Folha de dados(HTML) 14 Page - Microchip Technology

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MCP19111
DS22331A-page 14
 2013 Microchip Technology Inc.
2.1.23
PHASE PIN
The PHASE pin provides the return path for the high-
side gate driver. The source of the high-side MOSFET,
drain of the low-side MOSFET and the inductor are
connected to this pin.
2.1.24
BOOT PIN
The BOOT pin is the floating bootstrap supply pin for
the high-side gate driver. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side MOSFET.
2.1.25
+VSEN PIN
The non-inverting input of the unity gain amplifier used
for output voltage remote sensing is connected to the
+VSEN pin. This pin can be internally pulled-up to VDD
by setting PE1<PUEN> bit.
2.1.26
-VSEN PIN
The inverting input of the unity gain amplifier used for
output voltage remote sensing is connected to the
-VSEN pin. This pin can be internally pull-down to GND
by setting PE1<PDEN> bit.
2.1.27
+ISEN PIN
The non-inverting input of the current sense amplifier is
connected to the +ISEN pin.
2.1.28
-ISEN PIN
The inverting input of the current sense amplifier is
connected to the -ISEN pin.
2.1.29
EXPOSED PAD (EP)
There is no internal connection to the Exposed Thermal
Pad. The EP should be connected to the GND pin and
to the GND PCB plane to aid in the removal of the heat.



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