5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage range at terminals(2)

AVIN, PVIN, EN, FB, SW, VOUT

–0.3

7

V

Operating junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

All voltage values are with respect to network ground terminal.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage range

1.8

5.5

V

VOUT

Output voltage setting range

2.2

5.5

V

CIN

Effective input capacitance range

1.0

4.7

µF

COUT

Effective output capacitance range

IOUT <= 1A

4

10

1000

µF

IOUT > 1A

10

20

1000

µF

TJ

Operating junction temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC (1)

TPSM81033

TPSM81033

UNIT

VCD (QFN)- 9 PINS

VCD (QFN)- 9 PINS

Standard

EVM (2)

RθJA

Junction-to-ambient thermal resistance

74.8

39.7

°C/W

RθJC

Junction-to-case thermal resistance

36.6

NA

°C/W

RθJB

Junction-to-board thermal resistance

21.7

NA

°C/W

ΨJT

Junction-to-top characterization parameter

0.7

0.1

°C/W

ΨJB

Junction-to-board characterization parameter

21.1

19.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Measured on TPSM81033EVM, 4-layer, 2oz copper NA PCB.

TPSM81033

SLVSHL0D – JUNE 2024 – REVISED DECEMBER 2024

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