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Os motores de busca de Datasheet de Componentes eletrônicos |
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Os motores de busca de Datasheet de Componentes eletrônicos |
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EM260-RTR Folha de dados(PDF) 42 Page - Silicon image |
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EM260-RTR Folha de dados(HTML) 42 Page - Silicon image |
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42 / 50 page  EM260 120-0260-000M Rev 1.1 Page 42 10 QFN40 Footprint Figure 17 demonstrates the IPC-7351 recommended PCB footprint for the EM260 (QFN50P600x600x90-41). A ground pad in the bottom center of the package forms a 41st pin. A 3 x 3 array of non-thermal vias should connect the EM260 decal center shown in Figure 17 to a PCB ground plane. To properly solder the EM260 to the footprint, the Paste Mask layer (shown in Figure 18) should have a 3 x 3 array of circular openings at 0.076mm diameter spaced approximately 1.525mm apart (center to center). The solder mask (shown in Figure 19) has the same dimensions as the copper pour. This will force an evenly distributed solder flow and coplanar attachment to the PCB. For more information on the package footprint, please refer to the EM260 Reference Design. Figure 17. PCB Footprint for the EM260 Figure 18. Paste Mask Dimensions Figure 19. Solder Mask Dimensions |
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