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EM260-RTR Folha de dados(PDF) 20 Page - Silicon image |
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EM260-RTR Folha de dados(HTML) 20 Page - Silicon image |
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20 / 50 page EM260 120-0260-000M Rev 1.1 Page 20 Table 12 lists the specifications for the high-frequency crystal. Table 12. High-Frequency Crystal Specifications Parameter Test Conditions Min. Typ. Max. Unit Frequency 24 MHz Duty cycle 40 60 % Phase noise from 1kHz to 100kHz - 120 dBc/Hz Accuracy Initial, temperature, and aging - 40 + 40 ppm Crystal ESR Load capacitance of 10pF 100 Crystal ESR Load capacitance of 18pF 60 Start-up time to stable clock (max. bias) 1 ms Start-up time to stable clock (optimum bias) 2 ms Current consumption Good crystal: 20 ESR, 10pF load 0.2 0.3 mA Current consumption Worst-case crystals (60, 18pF or 100, 10pF) 0.5 mA Current consumption At maximum bias 1 mA 4.11.2 Internal RC Oscillator The EM260 has a low-power, low-frequency RC oscillator that runs all the time. Its nominal frequency is 10kHz. The RC oscillator has a coarse analog trim control, which is first adjusted to get the frequency as close to 10kHz as possible. This raw clock is used by the chip management block. It is also divided down to 1kHz using a variable divider to allow software to accurately calibrate it. This calibrated clock is used by the sleep timer. Timekeeping accuracy depends on temperature fluctuations the chip is exposed to, power supply impedance, and the calibration interval, but in general it will be better than 150ppm (including crystal error of 40ppm). Table 13 lists the specifications of the RC oscillator. Table 13. RC Oscillator Specifications Parameter Test Conditions Min. Typ. Max. Unit Frequency 10 kHz Analog trim steps 1 kHz Frequency variation with supply For a voltage drop from 3.6V to 3.1V or 2.6V to 2.1V 0.75 1.5 % 4.12 Random Number Generator The EM260 allows for the generation of random numbers by exposing a randomly generated bit from the RX ADC. Analog noise current is passed through the RX path, sampled by the receive ADC, and stored in a |
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