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MPC8360CVVALFGA Folha de dados(PDF) 10 Page - Freescale Semiconductor, Inc

Nome de Peças MPC8360CVVALFGA
Descrição Electrónicos  PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
PDF  102 Pages
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Fabricante Electrônico  FREESCALE [Freescale Semiconductor, Inc]
Página de início  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8360CVVALFGA Folha de dados(HTML) 10 Page - Freescale Semiconductor, Inc

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
10
Freescale Semiconductor
Overall DC Electrical Characteristics
This figure shows the undershoot and overshoot voltages at the interfaces of the device.
Figure 3. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD
PCI, local bus, DUART, system control and power management, I2C,
SPI, and JTAG I/O voltage
OVDD
3.3 V ± 330 mV
V
—
Junction temperature
TJ
0 to 105
–40 to 105
° C
2
Notes:
1. GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or
negative direction.
2. The operating conditions for junction temperature, TJ, on the 600/333/400 MHz and 500/333/500 MHz on rev. 2.0 silicon is
0
° to 70 ° C. Refer to Errata General9 in Chip Errata for the MPC8360E, Rev. 1.
3. For more information on Part Numbering, refer to Table 80.
Table 2. Recommended Operating Conditions (continued)
Characteristic
Symbol
Recommended
Value
Unit
Notes
GND
GND – 0.3 V
GND – 0.7 V
Not to Exceed 10%
G/L/OVDD + 20%
G/L/OVDD
G/L/OVDD + 5%
of tinterface
1
1. Note that tinterface refers to the clock period associated with the bus clock interface.
VIH
VIL
Note:



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