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MPC8360CVVALFGA Folha de dados(PDF) 63 Page - Freescale Semiconductor, Inc |
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MPC8360CVVALFGA Folha de dados(HTML) 63 Page - Freescale Semiconductor, Inc |
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63 / 102 page  MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5 Freescale Semiconductor 63 Package Parameters for the TBGA Package 20 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is available in a tape ball grid array (TBGA), see Section 20.1, “Package Parameters for the TBGA Package,” and Section 20.2, “Mechanical Dimensions of the TBGA Package,” for information on the package. 20.1 Package Parameters for the TBGA Package The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is 37.5 mm × 37.5 mm, 740 tape ball grid array (TBGA). Package outline 37.5 mm × 37.5 mm Interconnects 740 Pitch 1.00 mm Module height (typical) 1.46 mm Solder Balls 62 Sn/36 Pb/2 Ag (ZU package) 95.5 Sn/0.5 Cu/4Ag (VV package) Ball diameter (typical) 0.64 mm |
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