PIC16F5X datasheet(78/88 Pages) MICROCHIP

78 / 88 page

PIC16F5X

DS41213D-page 76

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

1.27 BSC

Overall Height

–

2.65

Molded Package Thickness

2.05

–

Standoff §

0.10

–

0.30

Overall Width

10.30 BSC

Molded Package Width

7.50 BSC

Overall Length

17.90 BSC

Chamfer (optional)

0.25

–

0.75

Foot Length

0.40

–

1.27

Footprint

1.40 REF

Foot Angle Top

0°

–

8°

Lead Thickness

0.18

–

0.33

Lead Width

0.31

–

0.51

Mold Draft Angle Top

5°

–

15°

Mold Draft Angle Bottom

5°

–

15°

NOTE 1

12 3

Microchip Technology Drawing C04-052B

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