PIC16F5X datasheet(76/88 Pages) MICROCHIP

76 / 88 page

PIC16F5X

DS41213D-page 74

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

.100 BSC

Top to Seating Plane

–

.200

Molded Package Thickness

.120

.135

.150

Base to Seating Plane

.015

–

Shoulder to Shoulder Width

.290

.310

.335

Molded Package Width

.240

.285

.295

Overall Length

1.345

1.365

1.400

Tip to Seating Plane

.110

.130

.150

Lead Thickness

.008

.010

.015

Upper Lead Width

.040

.050

.070

Lower Lead Width

.014

.018

.022

Overall Row Spacing §

–

.430

NOTE 1

Microchip Technology Drawing C04-070B

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