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GD32H757VMT7 Folha de dados(PDF) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

Nome de Peças GD32H757VMT7
Descrição Electrónicos  Arm® Cortex®-M7 32-bit MCU
PDF  151 Pages
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Fabricante Electrônico  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Página de início  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD32H757VMT7 Folha de dados(HTML) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

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GD32H757xx Datasheet
6
List of Tables
Table 2-1. GD32H757xx devices features and peripheral list ...............................................................
10
Table 2-2. GD32H757xx memory map .....................................................................................................
15
Table 2-3. GD32H757Zx LQFP144 pin definitions ..................................................................................
25
Table 2-4. GD32H757Vx LQFP100 pin definitions ..................................................................................
37
Table 2-5. GD32H757Vx BGA100 pin definitions....................................................................................
45
Table 2-6. Port A alternate functions summary......................................................................................
54
Table 2-7. Port B alternate functions summary......................................................................................
55
Table 2-8. Port C alternate functions summary......................................................................................
56
Table 2-9. Port D alternate functions summary......................................................................................
57
Table 2-10. Port E alternate functions summary ....................................................................................
58
Table 2-11. Port F alternate functions summary ....................................................................................
59
Table 2-12. Port G alternate functions summary....................................................................................
60
Table 2-13. Port H alternate functions summary ....................................................................................
60
Table 4-1. Abbreviations ...........................................................................................................................
84
Table 4-2. Absolute maximum ratings(1)(4) ...............................................................................................
85
Table 4-3. DC operating conditions .........................................................................................................
85
Table 4-4. Vcore operating conditions(1)(2)(3)............................................................................................
87
Table 4-5. Clock frequency(1)(2) .................................................................................................................
87
Table 4-6. TCM interface frequency(1) ......................................................................................................
88
Table 4-7. Operating conditions at Power up / Power down(1) ..............................................................
88
Table 4-8.
Power consumption characteristics(1)(2)(3)(4) .......................................................................... 88
Table 4-9. System level ESD and EFT characteristics(1) ........................................................................
92
Table 4-10. EMI characteristics(1) .............................................................................................................
92
Table 4-11. Component level ESD characteristics(1) ..............................................................................
93
Table 4-12. Latch-up characteristics(1) ....................................................................................................
93
Table 4-13. Power supply supervisor characteristics............................................................................
93
Table 4-14. USB regulator characteristics ..............................................................................................
95
Table 4-15. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics(4)
.....................................................................................................................................................................
95
Table 4-16. High speed external clock characteristics (HXTAL in bypass mode) ..............................
96
Table 4-17. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics(5)
96
Table 4-18. Low speed external user clock characteristics (LXTAL in bypass mode).......................
97
Table 4-19. High speed internal clock (IRC48M) characteristics ..........................................................
99
Table 4-20. High speed internal clock (IRC64M) characteristics ........................................................
100
Table 4-21. Low power internal clock (LPIRC4M) characteristics ......................................................
101
Table 4-22. Low speed internal clock (IRC32K) characteristics .........................................................
101
Table 4-23. PLL0/1/2 characteristics (wide VCO frequency range) ....................................................
101
Table 4-24. PLL0/1/2 characteristics (narrow VCO frequency range) ................................................
102
Table 4-25. PLLUSBHS0/1 characteristics(3) .........................................................................................
103
Table 4-26. Flash memory characteristics ............................................................................................
103



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