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GD32H757VMT7 Folha de dados(PDF) 3 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD32H757VMT7 Folha de dados(HTML) 3 Page - GigaDevice Semiconductor (Beijing) Inc. |
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3 / 151 page ![]() GD32H757xx Datasheet 2 3.15. Master direct memory access controller (MDMA)................................................ 68 3.16. DMA request multiplexer (DMAMUX) .................................................................... 69 3.17. Analog to digital converter (ADC) ......................................................................... 69 3.18. Digital to analog converter (DAC) ......................................................................... 70 3.19. Real time clock (RTC) and backup registers ........................................................ 70 3.20. Timers and PWM generation ................................................................................. 71 3.21. Universal synchronous/asynchronous receiver transmitter (USART/UART) .... 72 3.22. Inter-integrated circuit (I2C) .................................................................................. 73 3.23. Serial peripheral interface (SPI) ............................................................................ 73 3.24. Inter-IC sound (I2S) ................................................................................................ 74 3.25. OSPI I/O manager(OSPIM) ..................................................................................... 74 3.26. Octal-SPI interface(OSPI)....................................................................................... 74 3.27. Clock phase delay module (CPDM)....................................................................... 74 3.28. Digital camera interface (DCI)................................................................................ 75 3.29. TFT LCD interface (TLI).......................................................................................... 75 3.30. Receiver of Sony/Philips Digtial Interface (RSPDIF)............................................ 75 3.31. Serial Audio Interface (SAI) ................................................................................... 76 3.32. Image processing accelerator (IPA)...................................................................... 76 3.33. Secure digital input and output card interface (SDIO)......................................... 77 3.34. Management data input/output (MDIO) ................................................................. 77 3.35. External memory controller (EXMC) ..................................................................... 77 3.36. VREF ....................................................................................................................... 78 3.37. Low power digital temperature sensor (LPDTS) .................................................. 78 3.38. Encoder Divided-Output controller (EDOUT) ....................................................... 78 3.39. Controller area network (CAN) .............................................................................. 78 3.40. Ethernet (ENET)...................................................................................................... 79 3.41. Comparator (CMP).................................................................................................. 79 3.42. High-Performance Digital Filter (HPDF)................................................................ 80 3.43. Real-time decryption (RTDEC) .............................................................................. 80 3.44. Filter arithmetic accelerator (FAC) ........................................................................ 81 3.45. Hardware semaphore (HWSEM) ............................................................................ 82 3.46. Universal serial bus high-speed interface (USBHS) ............................................ 82 |
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