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HCS08 Folha de dados(PDF) 186 Page - NXP Semiconductors

Nome de Peças HCS08
Descrição Electrónicos  HCS08 Microcontrollers
PDF  198 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
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Appendix A Electrical Characteristics
MC9S08QD4 Series MCU Data Sheet, Rev. 6
186
Freescale Semiconductor
A.8
AC Characteristics
This section describes AC timing characteristics for each peripheral system.
A.8.1
Control Timing
Figure A-12. Reset Timing
Table A-8. Control Timing
Parameter
Symbol
Min
Typical1
1 Data in Typical column was characterized at 3.0 V, 25
°C.
Max
Unit
Bus frequency (tcyc = 1/fBus)fBus
1—8
MHz
Real-time interrupt internal oscillator period
tRTI
700
—
1300
μs
External reset pulse width2
2 This is the shortest pulse that is guaranteed to be recognized.
textrst
100
—
—
ns
IRQ pulse width
Asynchronous path2
Synchronous path3
3 This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
tILIH, tIHIL
100
1.5 tcyc
——
ns
KBIPx pulse width
Asynchronous path2
Synchronous path3
tILIH, tIHIL
100
1.5 tcyc
——
ns
Port rise and fall time (load = 50 pF)4
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
4 Timing is shown with respect to 20% V
DD and 80% VDD levels. Temperature range –40°C to 125°C.
tRise, tFall
—
—
3
30
—
—
ns
BKGD/MS setup time after issuing background debug force
reset to enter user or BDM modes
tMSSU
500
—
—
ns
BKGD/MS hold time after issuing background debug force
reset to enter user or BDM modes 5
5 To enter BDM mode following a POR, BKGD/MS must be held low during the power-up and for a hold time of t
MSH after VDD
rises above VLVD.
tMSH
100
—
—
μs
textrst
RESET PIN



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