HCS08 datasheet(14/198 Pages) NXP

14 / 198 page

MC9S08QD4 Series MCU Data Sheet, Rev. 6

Freescale Semiconductor

Chapter 12

Development Support

12.1 Introduction ...................................................................................................................................159

12.1.1 Forcing Active Background ............................................................................................159

12.1.2 Module Configuration .....................................................................................................159

12.1.3 Features ...........................................................................................................................160

12.2 Background Debug Controller (BDC) ..........................................................................................160

12.2.1 BKGD Pin Description ...................................................................................................161

12.2.2 Communication Details ..................................................................................................161

12.2.3 BDC Commands .............................................................................................................164

12.2.4 BDC Hardware Breakpoint .............................................................................................167

12.3 Register Definition ........................................................................................................................167

12.3.1 BDC Registers and Control Bits .....................................................................................168

12.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................170

Appendix A

Electrical Characteristics

A.1 Introduction ...................................................................................................................................173

A.2 Absolute Maximum Ratings ..........................................................................................................173

A.3 Thermal Characteristics .................................................................................................................174

A.4 ESD Protection and Latch-Up Immunity ......................................................................................175

A.5 DC Characteristics .........................................................................................................................175

A.6 Supply Current Characteristics ......................................................................................................182

A.7 Internal Clock Source Characteristics ...........................................................................................184

A.8 AC Characteristics .........................................................................................................................186

A.8.1 Control Timing ...............................................................................................................186

A.8.2 Timer/PWM (TPM) Module Timing ..............................................................................187

A.9 ADC Characteristics ......................................................................................................................188

A.10 Flash Specifications .......................................................................................................................189

Appendix B

Ordering Information and Mechanical Drawings

B.1 Ordering Information ....................................................................................................................191

B.1.1 Device Numbering Scheme ............................................................................................191

B.2 Mechanical Drawings ....................................................................................................................192

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