AFS090 datasheet(270/334 Pages) MICROSEMI

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DC and Power Characteristics

3- 20

R e visio n 2

Table 3-13 • Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1

CLOAD (pF)

VCCI (V)

Static Power

PDC8 (mW)2

Dynamic Power

PAC10 (µW/MHz)3

Applicable to Pro I/O Banks

Single-Ended

3.3 V LVTTL/LVCMOS

3.3

–

474.70

2.5 V LVCMOS

2.5

–

270.73

1.8 V LVCMOS

1.8

–

151.78

1.5 V LVCMOS (JESD8-11)

1.5

–

104.55

3.3 V PCI

3.3

–

204.61

3.3 V PCI-X

3.3

–

204.61

Voltage-Referenced

3.3 V GTL

3.3

–

24.08

2.5 V GTL

2.5

–

13.52

3.3 V GTL+

3.3

–

24.10

2.5 V GTL+

2.5

–

13.54

HSTL (I)

1.5

7.08

26.22

HSTL (II)

1.5

13.88

27.22

SSTL2 (I)

2.5

16.69

105.56

SSTL2 (II)

2.5

25.91

116.60

SSTL3 (I)

3.3

26.02

114.87

SSTL3 (II)

3.3

42.21

131.76

Differential

LVDS

–

2.5

7.70

89.62

LVPECL

–

3.3

19.42

168.02

Applicable to Advanced I/O Banks

Single-Ended

3.3 V LVTTL / 3.3 V LVCMOS

3.3

–

468.67

2.5 V LVCMOS

2.5

–

267.48

1.8 V LVCMOS

1.8

–

149.46

1.5 V LVCMOS (JESD8-11)

1.5

–

103.12

3.3 V PCI

3.3

–

201.02

3.3 V PCI-X

3.3

–

201.02

Notes:

1. Dynamic power consumption is given for standard load and software-default drive strength and output slew.

2. PDC8 is the static power (where applicable) measured on VCCI.

3. PAC10 is the total dynamic power measured on VCC and VCCI.

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