AP12H02TS

20V N+N-Channel Enhancement Mode MOSFET

AP12H02TS Rve:3.8

Reflow Soldering

The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is used

and the package is not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of

moisture in them can cause cracking of the plastic body. Preheating is necessary to dry the paste and evaporate the

binding agent. Preheating duration: 45 minutes at 45 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the

printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several

methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput

times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface

temperature of the packages should preferable be kept below 245 °C for thick/large packages (packages with a

thickness 2.5 mm or with a volume 350 mm3 so called thick/large packages). The top-surface temperature of the

packages should preferable be kept below 260 °C for thin/small packages (packages with a thickness < 2.5 mm and a

volume < 350 mm3 so called thin/small packages).

Stage

Condition

Duration

1’st Ram Up Rate

max3.0+/-2 /sec

-

Preheat

150 ~200

60~180 sec

2’nd Ram Up

max3.0+/-2 /sec

-

Solder Joint

217

above

60~150 sec

Peak Temp

260 +0/-5

20~40 sec

Ram Down rate

6 /sec max

-

Wave Soldering:

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a

high component density, as solder bridging and non-wetting can present major problems.

Manual Soldering:

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron

applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated

tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

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