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AP12H02TS Folha de dados(PDF) 2 Page - A POWER MICROELECTRONICS

Nome de Peças AP12H02TS
Descrição Electrónicos  20V NN-Channel Enhancement Mode MOSFET
PDF  7 Pages
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AP12H02TS
20V N+N-Channel Enhancement Mode MOSFET
AP12H02TS Rve:3.8
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min. Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250uA
20
-
-
V
RDS(ON)
Static Drain-Source On-
Resistance2
-
10
12.5
mΩ
VGS=2.5V, ID=12A
-
12
19
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
0.5
-
1.2
V
gfs
Forward Transconductance
VDS=5V, ID=20A
-
50
-
S
IDSS
Drain-Source Leakage Current
VDS=16V, VGS=0V
-
-
10
uA
IGSS
Gate-Source Leakage
-
-
nA
Qg
Total Gate Charge
ID=20A
VDS=10V
VGS=4.5V
-
16
25.6
nC
Qgs
Gate-Source Charge
-
3
-
nC
Qgd
Gate-Drain ("Miller") Charge
-
4.5
-
nC
td(on)
Turn-on Delay Time
VDS=10V
ID=1A
RG=3.3Ω
VGS=5V
-
10
-
ns
tr
Rise Time
-
13
-
ns
td(off)
Turn-off Delay Time
-
28
-
ns
tf
Fall Time
-
7
-
ns
Ciss
Input Capacitance
VGS=0V
VDS=10V
.
f=1.0MHz
-
1400 2240
pF
Coss
Output Capacitance
-
170
-
pF
Crss
Reverse Transfer Capacitance
-
135
-
pF
Rg
Gate Resistance
f=1.0MHz
-
1
2
Ω
VSD
Forward On Voltage2
IS=20A, VGS=0V
-
-
1.2
V
trr
Reverse Recovery Time
IS=12A,
VGS=0V,
dI/dt=100A/µs
-
8.5
-
ns
Qrr
Reverse Recovery Charge
-
2.5
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 60
℃/W at steady state.
4.Starting Tj=25oC , VDD=20V , L=0.1mH , RG=25Ω, VGS=10V
VGS=4.5V, ID=12A
永源微電子科技有限公司
VGS=±12V, VDS=0V
±
100



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