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S32K311NHT0MPAST Folha de dados(PDF) 84 Page - NXP Semiconductors

Nome de Peças S32K311NHT0MPAST
Descrição Electrónicos  Automotive General Purpose MCUs
PDF  143 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
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S32K311NHT0MPAST Folha de dados(HTML) 84 Page - NXP Semiconductors

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Table 38. Temperature Sensor (continued)
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
TS_ACC2
Temperature output
error at circuit output
(Voltage) 1,2,3
-10
0
+10
°C
-40 °C <= Tj <=100 °C —
TS_TSTART
Circuit start up time
—
4
30
µs
—
—
TS_TADCSA
Required ADC
sampling time 1
1.2
—
—
µs
—
—
1. Required ADC sampling time specified by parameter TS_TADCSA needs to be used at the ADC conversion to guarantee
the specified accuracy. A smaller sampling time leads to a less accurate result.
2. Note: The temperature sensor measures the junction temperature Tj at the location where it is placed on die. The local Tj
is modulated by current and previous active state of the circuit elements on die.
3. The error caused by ADC conversion and provided temperature calculation formula is not included.
11 Clocking modules
11.1 FIRC
Table 39. FIRC
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
fFIRC
FIRC nominal
Frequency
—
48
—
MHz
—
—
FACC
FIRC Frequency
deviation across
process, voltage,
and temperature
after trimming
-5
—
5
%
—
—
TSTART
Startup Time 1
—
10
25
us
—
—
1. Startup time is for reference only.
11.2 SIRC
Table 40. SIRC
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
fSIRC
SIRC nominal
Frequency
—
32
—
KHz
—
—
fSIRC_ACC
SIRC Frequency
deviation across
process, voltage,
and temperature
after trimming
-10
—
10
%
—
—
TSIRC_start
SIRC Startup Time 1 —
—
3
ms
—
—
TSIRC_DC
SIRC duty cycle
30
—
70
%
—
—
NXP Semiconductors
Clocking modules
S32K3xx Data Sheet, Rev. 9.1, 03/2024
Data Sheet: Technical Data
Preliminary Information for S32K388
84 / 143



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