S32K311NHT0MPAST datasheet(22/143 Pages) NXP

22 / 143 page

10.

If a positive injection current is present in one or more I/O pins, and the device is in Low-Speed RUN or STANDBY mode,

the VDD_HV_A (or respectively, VDD_HV_B) may lift and cause unexpected behavior. Therefore, it is recommended to

add external protection hardware, to safely cover this scenario.

11.

The MCU supply ramp rate parameter must be applicable to the MCU input/external supplies. The ramp rate

assumes that the S32K3xx HW design guidelines available on www.nxp.com are followed.

5.3 Thermal operating characteristics

Table 4. Thermal operating characteristics

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

Tamb

Ambient temperature -40

—

105

°C

V- Grade

—

Tamb

Ambient temperature -40

—

125

°C

M- Grade

—

Junction

temperature

-40

—

150

°C

—

For S32K388, applications running at 125°C Tamb, thermal management schemes at PCB level will have to be deployed to keep

TJ below 150°C.

5.4 ESD and Latch-up Protection Characteristics

Table 5. ESD and Latch-up Protection Characteristics

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

Vhbm

Electrostatic

discharge voltage,

human body model

(HBM) 1,2,3

-2000

—

2000

—

Vcdm

Electrostatic

discharge voltage,

charged-device

model (CDM),

all pins except

corner 1,3,4

-500

—

500

—

Vcdm

Electrostatic

discharge voltage,

charged-device

model (CDM), corner

pins 1,3,4

-750

—

750

—

Ilat

Latch-up current at

ambient temperature

of 125°C 5

-100

—

100

—

1. Device failure is defined as: "If after exposure to ESD pulses, the device does not meet specification requirements."

2. This parameter is tested in conformity with AEC-Q100-002.

3. All ESD testing conforms with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.

4. This parameter is tested in conformity with AEC-Q100-011.

5. This parameter is tested in conformity with AEC-Q100-004.

NXP Semiconductors

General

S32K3xx Data Sheet, Rev. 9.1, 03/2024

Data Sheet: Technical Data

Preliminary Information for S32K388

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