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UCD3138064RGCR Folha de dados(PDF) 13 Page - Texas Instruments |
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UCD3138064RGCR Folha de dados(HTML) 13 Page - Texas Instruments |
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13 / 104 page ![]() 8.4 Thermal Information THERMAL METRIC(1) UCD3138064 UNIT 64 Pin QFN (RGC) 40 Pin QFN (RJA) 40 Pin QFN (RMH) RθJA Junction-to-ambient thermal resistance 19.9 25.4 30.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 5.7 14.0 15.7 RθJB Junction-to-board thermal resistance 3.1 7.7 5.7 ψJT Junction-to-top characterization parameter 0.1 0.1 0.2 ψJB Junction-to-board characterization parameter 3.0 7.6 5.7 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.3 0.9 0.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. www.ti.com UCD3138064 SLUSB72D – MARCH 2013 – REVISED APRIL 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: UCD3138064 |
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