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UCD3138064RGCR Folha de dados(PDF) 78 Page - Texas Instruments

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Nome de Peças UCD3138064RGCR
Descrição Electrónicos  UCD3138064 Highly Integrated Digital Controller for Isolated Power With 64-kB Program Flash Memory
PDF  104 Pages
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
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UCD3138064RGCR Folha de dados(HTML) 78 Page - Texas Instruments

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• Avoid long traces close to radiation components and place them into an internal layer. It is preferred to have
grounding shield and add a termination circuit at the end of long traces.
• Do NOT use a ferrite bead or a resistor with a value of 3-Ω or larger resistor to connect between V33A and
V33D.
• Avoid negative current/negative voltage (–0.3 V) on all pins. Avoid voltage spikes of more than 3.8V on all
pins. Schottky diodes may be required to clamp the voltage on any pins that could have voltage spikes during
surge tests. Note that Schottky diodes have relatively higher leakage current, which can affect the voltage
sensing at high temperature.
• If the bias supply to the device is a switching supply, ripple should be minimized. The higher the peak-to-peak
magnitude and frequency of the ripple, the more the oscillator frequency changes.
UCD3138 Pin Connection Recommendation
The UCD3138 device is a highly integrated controller with a large number of mixed signals. It is important to
group each pin, select good components, have appropriate connections to each pin, and make good component
placement on the PCB to reduce noise coupling and to prevent chip mal-function. First, group all digital circuitry
and analog circuitry. Second, place digital circuitry close to each other, place analog circuitry close to each other,
and then make connections among them by a solid plane(SGND). To achieve a robust design, TI recommends
at least a 4-layer board.
Next, layout considerations and examples are provided for some critical pins or signals.
12.1.4.1 Current Amplifier With EADC Connection
As shown in Current Amplifier Connected With EADC, if a current amplifier is used for current sensing, a
differential input is recommended to suppress common mode noise. Then it is followed by a local low-pass filter
(LPF), LPF should be placed close to the EAP and EAN pins of the UCD device. Both filters must be connected
to the same ground plane (SGND).
Figure 12-2. Current Amplifier Connected With EADC
12.1.4.2 DPWM Synchronization
For half bridge or full-bridge converter, where more than one DPWM modules are used to drive multiple pairs of
MOSFETs, synchronization between DPWM modules is required. The synchronization can be achieved by using
Master-Slave mode. A slaved DPWM can be synchronized with other Master DPWM or Slave DPWM. Without
synchronization, the DPWM could go out of synchronization at large currents which can cause catastrophic
damage.
Please note: For UCD3138ARMH and UCD3138ARJA, if the system use case is below -30C, DPWM fixed edge
alignment should be avoided and at least a 4ns gap should be configured.
UCD3138064
SLUSB72D – MARCH 2013 – REVISED APRIL 2021
www.ti.com
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