SPC564A80B4 datasheet(84/157 Pages) STMICROELECTRONICS

84 / 157 page

Electrical characteristics

SPC564A74L7, SPC564A80B4, SPC564A80L7

84/157

Doc ID 15399 Rev 9

RJCtop

D Junction-to-Case(4)

5°C/W



Junction-to-Package Top, Natural

Convection(5)

2°C/W

Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package.

Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Table 10.

Thermal characteristics for 176-pin QFP(1) (continued)

Symbol

Parameter

Conditions

Value

Unit

Table 11.

Thermal characteristics for 208-pin LBGA(1)

Symbol

Parameter

Conditions

Value

Unit

RJA

Junction-to-Ambient, Natural

Convection(2),(3)

One layer board - 1s

°C/W

RJA

Junction-to-Ambient, Natural

Convection(2),(4)

Four layer board - 2s2p

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2),(4)

at 200 ft./min., one layer

board

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2),(4)

at 200 ft./min., four layer

board 2s2p

°C/W

RJB

D Junction-to-board(5)

Four layer board - 2s2p

°C/W

RJC

D Junction-to-case(6)

6°C/W



Junction-to-package top natural

convection(7)

2°C/W

Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

SPC564A80B4 Folha de dados(PDF) 84 Page - STMicroelectronics

SPC564A80B4 Folha de dados(HTML) 84 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Folha de dados Download

Ligação URL