SPC564A80B4 datasheet(83/157 Pages) STMICROELECTRONICS

83 / 157 page

SPC564A74L7, SPC564A80B4, SPC564A80L7

Electrical characteristics

Doc ID 15399 Rev 9

83/157

3.3

Thermal characteristics

Maximum operating

temperature range - die

junction temperature

–40.0

150.0

TSTG

Storage temperature range

–55.0

150.0

TSDR

Maximum solder

temperature(13)

—

260.0

MSL

Moisture sensitivity level(14)

—3

Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings

only, and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device

reliability or cause permanent damage to the device.

Allowed 2 V for 10 hours cumulative time, remaining time at 1.2 V +10%.

The VFLASH supply is connected to VRC33 in the package substrate. This specification applies to calibration package

devices only.

Allowed 5.3 V for 10 hours cumulative time, remaining time at 3.3 V +10%.

Allowed 5.9 V for 10 hours cumulative time, remaining time at 5 V +10%.

All functional non-supply I/O pins are clamped to VSS and VDDE, or VDDEH.

AC signal overshoot and undershoot of up to 2.0 V of the input voltages is permitted for an accumulative duration of 60

hours over the complete lifetime of the device (injection current not limited for this duration).

Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.

Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if the

maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.

10. Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies, if the

maximum injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.

11. Total injection current for all pins (including both digital and analog) must not exceed 25 mA.

12. Total injection current for all analog input pins must not exceed 15 mA.

13. Solder profile per IPC/JEDEC J-STD-020D.

14. Moisture sensitivity per JEDEC test method A112.

Table 9.

Absolute maximum ratings(1) (continued)

Symbol

Parameter

Conditions

Value

Unit

min

max

Table 10.

Thermal characteristics for 176-pin QFP(1)

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection(2)

Single layer board - 1s

°C/W

RJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board - 2s2p

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2)

200 ft./min., single layer

board - 1s

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2)

at 200 ft./min., four layer

board - 2s2p

°C/W

RJB

D Junction-to-Board(3)

°C/W

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