STTS2004 datasheet(53/58 Pages) STMICROELECTRONICS

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STTS2004

Package mechanical data

Table 35 lists variations of landing pattern implementations, ranked as “Preferred” and

Minimum Acceptable” based on the JEDEC proposal.

Table 35. Parameters for landing pattern - TDFN8 package (DN)

Parameter

Description

Dimension

Min

Nom

Max

Heat paddle width

1.40

1.60

Heat paddle height

1.40

1.60

Heat paddle centerline to contact inner locus

1.00

Contact length

0.70

0.80

Heat paddle to contact keepout

0.20

Contact to contact keepout

0.20

Contact centerline to contact centerline pitch for inner contacts

0.50

Contact width for inner contacts

0.25

0.30

Landing pattern centerline to outer contact centerline, “minimum

acceptable” option(1)

0.50

Corner contact width, “minimum acceptable option”(1)

0.25

0.30

Landing pattern centerline to outer contact centerline, “preferred”

option(2)

0.60

Corner contact width, “preferred” option(2)

0.45

0.50

1. Minimum acceptable option to be used when routing prevents preferred width contact.

2. Preferred option to be used when possible.

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