UCD3138 datasheet(5/89 Pages) TI1

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UCD3138

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SLUSAP2G – MARCH 2012 – REVISED SEPTEMBER 2016

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Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (November 2013) to Revision G

Page

•

Added Device and Documentation Support section and ESD Ratings table.

................................................. 2

•

Changed document flow to match UCD3138A.

................................................................................... 2

•

Added RJA package to Features and the Device Information table.

.......................................................... 2

•

Added RJA package.

.............................................................................................................. 10

•

Added the RJA package to the Thermal Information table.

................................................................... 13

Changes from Revision E (August 2013) to Revision F

Page

•

Changed Top Side Marking info from " 3138 " to " 3138RMH " in the Ordering Information table.

..................... 13

Changes from Revision D (August 2013) to Revision E

Page

•

Added UCD3138RMH to Feature bullet

........................................................................................... 1

•

Added RMH package pinout drawing

.............................................................................................. 9

•

Added RMH package thermal specifications

.................................................................................... 13

•

Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal pull

up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)"

................................................ 45

Changes from Revision C (March 2013) to Revision D

Page

•

Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°C ....................................................... 13

•

Added BP18 Voltage vs Temperature graphic

.................................................................................. 24

Changes from Revision B (July 2012) to Revision C

Page

•

Deleted "JTAG Debug Port" feature bullet

........................................................................................ 1

•

Deleted text string "JTAG debug" from Description section.

.................................................................... 2

•

Added NOTE under Functional Block Diagram

................................................................................... 3

•

Deleted "JTAG" option from Product Selection Matrix.

.......................................................................... 8

•

Added text to Pin 54 description

.................................................................................................. 11

•

Added text to Pin 35 description

.................................................................................................. 12

•

Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions Tables

............................... 13

•

Deleted VDD specification from System Performance section of Electrical Characteristics................................ 15

•

Added footnote to Table 5-1

....................................................................................................... 16

•

Added text string regarding front-end 2 in the Front End section

............................................................ 19

•

Deleted text string reference to "JTAG port" in ARM Processor section

..................................................... 25

•

Changed illustration in IC Grounding and Layout Recommendations section

.............................................. 68

•

Changed text strings in

............................................................................................................ 69

•

Added document to References list

............................................................................................... 71

Changes from Revision A (March 2012) to Revision B

Page

•

Added Feature bullets

................................................................................................................ 1

•

Changed "Dual Edge Modulation" to "Triangular Modulation" in Features section

.......................................... 1

•

Changed "265 ksps" to "267 ksps" in Features section

......................................................................... 1

•

Clarified number of UARTs in Feature section

................................................................................... 1

•

Changed "FDPP" to "DDP" throughout.

........................................................................................... 2

•

Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection Matrix

table.

.................................................................................................................................... 8

•

Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics

........................................ 14

•

Changed EAP – EAN Error voltage digital resolution MIN values for AFE = 3, AFE = 2, AFE = 1, AFE = 0 from

0.95, 1.90, 3.72, and 7.3 respectively; to, 0.8, 1.7, 3.55, and 6.90 respectively.

........................................... 14

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