SSM2537ACBZ-R7 datasheet(15/16 Pages) AD

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Data Sheet

SSM2537

Rev. 0 | Page 15 of 16

APPLICATIONS INFORMATION

LAYOUT

As output power increases, take care to lay out PCB traces and

wires properly among the amplifier, load, and power supply.

A good practice is to use short, wide PCB tracks to decrease

voltage drops and minimize inductance. Avoid ground loops

where possible to minimize common-mode current associated

with separate paths to ground. Ensure that track widths are

at least 200 mil per inch of track length for the lowest DCR,

and use 1 oz or 2 oz copper PCB traces to further reduce IR

drops and inductance. A poor layout increases voltage drops,

consequently affecting efficiency. Use large traces for the power

supply inputs and amplifier outputs to minimize losses due to

parasitic trace resistance.

Proper grounding helps to improve audio performance,

minimize crosstalk between channels, and prevent switching

noise from coupling into the audio signal. To maintain high

output swing and high peak output power, the PCB traces that

connect the output pins to the load, as well as the PCB traces

to the supply pins, should be as wide as possible to maintain

the minimum trace resistances. It is also recommended that

a large ground plane be used for minimum impedances.

In addition, good PCB layout isolates critical analog paths from

sources of high interference. Separate high frequency circuits

(analog and digital) from low frequency circuits.

Properly designed multilayer PCBs can reduce EMI emissions

and increase immunity to the RF field by a factor of 10 or more,

compared with double-sided boards. A multilayer board allows

a complete layer to be used for the ground plane, whereas the

ground plane side of a double-sided board is often disrupted by

signal crossover.

POWER SUPPLY DECOUPLING

To ensure high efficiency, low total harmonic distortion (THD),

and high PSRR, proper power supply decoupling is necessary.

Noise transients on the power supply lines are short-duration

voltage spikes. These spikes can contain frequency components

that extend into the hundreds of megahertz.

The power supply input must be decoupled with a good quality,

low ESL, low ESR capacitor, with a minimum value of 4.7 µF.

This capacitor bypasses low frequency noises to the ground

plane. For high frequency transient noises, use a 0.1 µF capac-

itor as close as possible to the PVDD and VDD pins of the

device. Placing the decoupling capacitors as close as possible

to the SSM2537 helps to maintain efficient performance.

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