MPC8360CVVALDHA datasheet(91/102 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5

Freescale Semiconductor

Thermal Characteristics

Example 1. Sample Table Use

•

Example A. To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC Engine

clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. ‘s10’ and ‘c1’ are selected from Table 76. SPMF

is 1000, CORPLL is 0000011, CEPMF is 01001, and CEPDF is 0.

•

Example B. To configure the device with CSBCSB clock rate of 266 MHz, core rate of 533 MHz and QUICC Engine

clock rate 400 MHz while the input clock rate is 66 MHz. Conf No. ‘s5h’ and ‘c2h’ are selected from Table 76. SPMF

is 0100, CORPLL is 0000100, CEPMF is 00110, and CEPDF is 0.

Thermal

This section describes the thermal specifications of the MPC8360E/58E.

22.1

Thermal Characteristics

This table provides the package thermal characteristics for the 37.5 mm × 37.5 mm 740-TBGA package.

Index

SPMF

CORE

PLL

CEPMF CEPDF

Input Clock

(MHz)

CSB Freq

(MHz)

Core Freq

(MHz)

QUICC

Engine Freq

(MHz)

400

(MHz)

533

(MHz)

667

(MHz)

1000

0000011

01001

266

400

300

∞∞

∞

0100

0000100

00110

266

533

400

∞∞

∞

Table 77. Package Thermal Characteristics for the TBGA Package

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single-layer board (1s)

RθJA

° C/W

1, 2

Junction-to-ambient natural convection on four-layer board (2s2p)

RθJA

° C/W

1, 3

Junction-to-ambient (@1 m/s) on single-layer board (1s)

RθJMA

° C/W

1, 3

Junction-to-ambient (@ 1 m/s) on four-layer board (2s2p)

RθJMA

° C/W

1, 3

Junction-to-ambient (@ 2 m/s) on single-layer board (1s)

RθJMA

° C/W

1, 3

Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)

RθJMA

° C/W

1, 3

Junction-to-board thermal

RθJB

4.5

° C/W

Junction-to-case thermal

RθJC

1.1

° C/W

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