RA4T1 datasheet(4/89 Pages) RENESAS

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Table 1.7

Communication interfaces

Feature

Functional description

Serial Communications Interface (SCI)

The Serial Communications Interface (SCI) × 2 channels have asynchronous and synchronous

serial interfaces:

● Asynchronous interfaces (UART and Asynchronous Communications Interface Adapter

(ACIA))

● 8-bit clock synchronous interface

● Simple IIC (master-only)

● Simple SPI

● Smart card interface

● Manchester interface

The smart card interface complies with the ISO/IEC 7816-3 standard for electronic signals and

transmission protocol. SCIn (n = 0, 9) has FIFO buffers to enable continuous and full-duplex

communication, and the data transfer speed can be configured independently using an on-chip

baud rate generator.

I3C bus interface (I3C)

The I3C bus interface (I3C) has one channel. The I3C module conforms with and provides a

subset of the NXP I2C (Inter-Integrated Circuit) bus interface functions and a subset of the MIPI

I3C.

Serial Peripheral Interface (SPI)

The Serial Peripheral Interface (SPI) has 2 channels. The SPI provides high-speed full-duplex

synchronous serial communications with multiple processors and peripheral devices.

Control Area Network with Flexible

Data-Rate Module (CANFD)

The CAN with Flexible Data-Rate (CANFD) module can handle classical CAN frames and

CANFD frames complied with ISO 11898-1 standard.

The module supports 4 transmit buffers and 32 receive buffers.

Table 1.8

Analog

Feature

Functional description

12-bit A/D Converter (ADC12)

A 12-bit successive approximation A/D converter (ADC12) with sample-and-hold circuits

and programmable gain amplifiers (PGA) are provided. Up to 12 analog input channels

are selectable. Temperature sensor output and internal reference voltage are selectable for

conversion.

12-bit D/A Converter (DAC12)

A 12-bit D/A converter (DAC12) is provided.

High-Speed Analog Comparator

(ACMPHS)

The High-Speed Analog Comparator (ACMPHS) compares a test voltage with a reference

voltage and provides a digital output based on the conversion result. Both the test and reference

voltages can be provided to the comparator from internal sources such as the DAC12 output

and internal reference voltage, and an external source with or without an internal PGA. Such

flexibility is useful in applications that require go/no-go comparisons to be performed between

analog signals without necessarily requiring A/D conversion.

See section x, High-Speed Analog Comparator.

Temperature Sensor (TSN)

The on-chip Temperature Sensor (TSN) determines and monitors the die temperature for

reliable operation of the device. The sensor outputs a voltage directly proportional to the die

temperature, and the relationship between the die temperature and the output voltage is fairly

linear. The output voltage is provided to the ADC12 for conversion and can be further used by

the end application.

Table 1.9

Data processing

Feature

Functional description

Cyclic Redundancy Check (CRC)

calculator

The Cyclic Redundancy Check (CRC) generates CRC codes to detect errors in the data. The

bit order of CRC calculation results can be switched for LSB-first or MSB-first communication.

Additionally, various CRC-generation polynomials are available.

Data Operation Circuit (DOC)

The Data Operation Circuit (DOC) compares, adds, and subtracts 16-bit data. When a selected

condition applies, 16-bit data is compared and an interrupt can be generated.

Table 1.10

Data processing accelerator

Feature

Functional description

Trigonometric function unit (TFU)

Calculation of sine, cosine, arctangent, and sqrt(x2 + y2)

● A sine and cosine can be simultaneously calculated

● An arctangent and sqrt(x2 + y2) can be simultaneously

calculated

RA4T1 Datasheet

1. Overview

R01DS0415EJ0140 Rev.1.40

May 29, 2026

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