PPC440GP-3CC400EZ datasheet(56/83 Pages) AMCC

Nome de Peças	PPC440GP-3CC400EZ

Descrição Electrónicos	Power PC 440GP Embedded Processor

PDF	83 Pages

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Fabricante Electrônico	AMCC [Applied Micro Circuits Corporation]

Página de início	http://www.amcc.com

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440GP – Power PC 440GP Embedded Processor

AMCC

Revision 1.07 – October 4, 2007

Data Sheet

Package Thermal Specifications

Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:

Parameter

Symbol

Package

Airflow

ft/min (m/sec)

Unit

Notes

0 (0)

100 (0.51)

200 (1.02)

Junction-to-case thermal resistance

Ceramic

<0.1

°C/W

Plastic

1.2

°C/W

1, 3

Case-to-ambient thermal resistance (w/o heat

sink)

Ceramic

18.9

17.7

16.3

°C/W

Plastic

20.8

°C/W

2, 3

Junction-to-ball (typical)

Ceramic

°C/W

Plastic

8.0

°C/W

Notes:

1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict

thermal performance in production equipment environments. The operational case temperature must be maintained.

3. Modeled on standard JEDEC 2S2P card, 50x50mm

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