4

LPV821

SNOSD36 – AUGUST 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

See

(1)

MIN

MAX

UNIT

Voltage

-0.3

4

V

(V–) - 0.3

(V+) + 0.3

- 0.3

+ 0.3

Current

–10

10

mA

Continuous

Continuous

Junction temperature

150

°C

Operating ambient temperature

–40

125

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±1000

V

±250

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply

voltage

1.7

3.6

V

Specified

temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC

LPV821

UNIT

DBV (SOT)

5 PINS

Junction-to-ambient thermal resistance

218.4

°C/W

Junction-to-case (top) thermal resistance

101.3

°C/W

Junction-to-board thermal resistance

52.9

°C/W

Junction-to-top characterization parameter

18.9

°C/W

Junction-to-board characterization parameter

52.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W