PIFE32251B-R68MS datasheet(148/157 Pages) TI1

Nome de Peças	PIFE32251B-R68MS

Descrição Electrónicos	Simple and Flexible Wide Input Voltage PMU for Mobile Computers

PDF	157 Pages

Scroll/Zoom	100%

Fabricante Electrônico	TI1 [Texas Instruments]

Página de início	http://www.ti.com

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148 / 157 page

148

TPS650830

SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016

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Product Folder Links: TPS650830

Layout

9.2.3

ZCG Package

Figure 9-6. Top Layer ZCG Layout

Figure 9-7. Bottom Layer ZCG Layout

9.3

Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically

requires special attention to power dissipation. Many system-dependent issues such as thermal coupling,

airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components

affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™

•

Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table please check the

Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application

Note (SPRA953).

PIFE32251B-R68MS Folha de dados(PDF) 148 Page - Texas Instruments