PS081 datasheet(20/155 Pages) AMSCO

20 / 155 page

acam-messelectronic gmbh - Friedrich-List-Str.4 - D-76297 Stutensee-Blankenloch - Germany - www.acam.de

2-11

PSØ81

QFN56 Recommended Pad Layout

inch

0.4

0.016

Gmin

6.3

0.248

Zmax

8.0

0.315

D2’

5.4

0.213

Amax

5.45

0.215

0.25

0.010

0.85

0.033

0.75

0.030

Note: Size of ground plane may not be

reduced. It should not contain any vias.

Figure 2.9 Pad Layout

RoHS:

PS081FN in QFN56 is RoHS compliant

Material list:

Lead frame

C194 Cu with PPF finish (NiPdAU)

Die Attach

Ablebond 8600, ABlestik

Bond wires

Gold

Mold

CEL9220HF13H, Hitachi

Marking

Laser

Moisture Sensitivity Level 1 (JEDEC J-STD-020,033)

Reflow Soldering Profile

Average ramp-up rate (TL to Tp)

3 °C/second max.

Preheat

- Temperature Min (TSmin)

140 °C

- Temperature Max (TSmax)

200 °C

- Time (min to max) ts

60 - 120 seconds

Tsmax to TL

- Ramp-up rate

3 °C/second max.

Time maintained above:

- Temperature (TL)

220 °C

- time (tL)

30 seconds

Peak Temperature (Tp)

245 +0 -5 °C

Time within 5°C of actual Peak

10 seconds

Member of the ams Group

PS081 Folha de dados(PDF) 20 Page - ams AG

PS081 Folha de dados(HTML) 20 Page - ams AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Folha de dados Download

Ligação URL