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TGS2353 Folha de dados(PDF) 8 Page - TriQuint Semiconductor |
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TGS2353 Folha de dados(HTML) 8 Page - TriQuint Semiconductor |
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8 / 10 page ![]() TGS2353 DC – 18 GHz High Power SPDT Switch Mechanical Information 0.175 0.0 0.300 0.925 1.150 0.175 0.300 0.925 0.985 0.0 0.177 0.621 0.826 1.031 1.476 1.652 1.476 1.275 0.377 0.177 1 2 3 4 5 6 7 Unit: millimeters Thickness: 0.10 Die x, y size tolerance: +/- 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad Symbol Pad Size 1 RF In 0.100 x 0.200 2, 7 Vc2 0.100 x 0.100 3, 6 Vc1 0.100 x 0.100 4 RF Out1 0.200 x 0.100 5 RF Out2 0.200 x 0.100 Preliminary Data Sheet: Rev A 06/20/11 - 8 of 10 - Disclaimer: Subject to change without notice © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® |
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