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IRHN7450SE Folha de dados(PDF) 3 Page - International Rectifier

Nome de Peças IRHN7450SE
Descrição Electrónicos  TRANSISTOR N-CHANNEL(BVdss=500V, Rds(on)=0.51ohm, Id=12A)
PDF  4 Pages
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Fabricante Electrônico  IRF [International Rectifier]
Página de início  http://www.irf.com
Logo IRF - International Rectifier

IRHN7450SE Folha de dados(HTML) 3 Page - International Rectifier

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Table 2. High Dose Rate “
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Parameter
Min. Typ Max. Min. Typ. Max.
Units
Test Conditions
VDSS
Drain-to-Source Voltage
400
400
V
Applied drain-to-source voltage
during gamma-dot
IPP
8
8
A
Peak radiation induced photo-current
di/dt
15
3
A/µsec Rate of rise of photo-current
L1
27
133
µH
Circuit inductance required to limit di/dt
Table 3. Single Event Effects ”
LET (Si)
Fluence
Range
VDS Bias
VGS Bias
Parameter
Typ.
Units
Ion
(MeV/mg/cm2)
(ions/cm2)(
µm)
(V)
(V)
BVDSS
500
V
Ni
28
1 x 105
~35
400
-5
Radiation Performance of Rad Hard HEXFETs
IRHN7450SE Device
Radiation Characteristics
Table 1. Low Dose Rate ‘ ’
IRHN7450SE
Parameter
100K Rads (Si)
Units
Test Conditions •
min.
max.
BVDSS
Drain-to-Source Breakdown Voltage
500
V
VGS = 0V, ID = 1.0 mA
VGS(th)
GateThreshold Voltage 
2.0
4.5
VGS = VDS, ID = 1.0 mA
IGSS
Gate-to-Source Leakage Forward
100
nA
VGS = 20V
IGSS
Gate-to-Source Leakage Reverse
-100
VGS = -20V
IDSS
Zero Gate Voltage Drain Current
50
µAVDS = 0.8 x Max Rating, VGS = 0V
RDS(on)1
Static Drain-to-Source 
0.51
VGS = 12V, ID = 7A
On-State Resistance One
VSD
Diode Forward Voltage 
1.6
V
TC = 25°C, IS = 12A,VGS = 0V
International Rectifier Radiation Hardened HEX-
FETs are tested to verify their hardness capability.
The hardness assurance program at International
Rectifier uses two radiation environments.
Every manufacturing lot is tested in a low dose rate
(total dose) environment per MlL-STD-750, test
method 1019. International Rectifier has imposed a
standard gate voltage of 12 volts per note 6 and a
VDSS bias condition equal to 80% of the device
rated voltage per note 7. Pre- and post-radiation
limits of the devices irradiated to 1 x 105 Rads (Si)
are identical and are presented in Table 1. The val-
ues in Table 1 will be met for either of the two low
dose rate test circuits that are used.
Both pre- and post-radiation performance are
tested and specified using the same drive circuitry
and test conditions in order to provide a direct com-
parison. It should be noted that at a radiation level
of 1 x 105 Rads (Si), no change in limits are speci-
fied in DC parameters.
High dose rate testing may be done on a special
request basis, using a dose rate up to 1 x 1012 Rads
(Si)/Sec.
International Rectifier radiation hardened HEXFETs
have been characterized in neutron and heavy ion
Single Event Effects (SEE) environments. Single
Event Effects characterization is shown in Table 3.
To Order
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