Thermal Resistance

Parameter

Min. Typ. Max. Units

Test Conditions

RthJC

Junction-to-Case

—

—

0.83

RthJ-PCB

Junction-to-PC board

—

TBD

—

soldered to a copper-clad PC board

Source-Drain Diode Ratings and Characteristics

Parameter

Min. Typ. Max. Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

12

Modified MOSFET symbol showing the

ISM

Pulse Source Current (Body Diode) Œ

——

48

integral reverse p-n junction rectifier.

VSD

Diode Forward Voltage

—

—

1.6

V

trr

Reverse RecoveryTime

—

—

500

ns

Tj = 25°C, IF = 12A, di/dt ≤ 100A/µs

QRR

Reverse Recovery Charge

—

—

16

µCVDD ≤ 50V

ton

ForwardTurn-OnTime

Intrinsic turn-on time is negligible.Turn-on speed is substantially controlled by LS + LD.

Parameter

Min.

Typ. Max. Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

500

—

—

V

VGS = 0V, ID = 1.0 mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

0.6

—

V/°C

Reference to 25°C, ID = 1.0 mA

Voltage

RDS(on)

Static Drain-to-Source

—

—

0.51

VGS = 12V, ID = 7A

On-State Resistance

—

—

0.57

Ω

VGS = 12V, ID = 12A

VGS(th)

GateThreshold Voltage

2.5

—

4.5

V

VDS = VGS, ID = 1.0 mA

gfs

Forward Transconductance

3

—

—

S ( )VDS > 15V, IDS = 7A 

IDSS

Zero Gate Voltage Drain Current

—

—

50

VDS = 0.8 x Max Rating,VGS = 0V

—

—

250

VDS = 0.8 x Max Rating

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

100

VGS = 20V

IGSS

Gate-to-Source Leakage Reverse

—

—

-100

VGS = -20V

Qg

Total Gate Charge

—

—

140

VGS =12V, ID = 12A

Qgs

Gate-to-Source Charge

—

—

50

VDS = Max. Rating x 0.5

Qgd

Gate-to-Drain (“Miller”) Charge

—

—

60

td(on)

Turn-On DelayTime

—

—

35

VDD= 250V, ID =12A,

tr

Rise Time

—

—

50

RG = 2.35Ω

td(off)

Turn-Off Delay Time

—

—

100

tf

Fall Time

—

—

60

LD

Internal Drain Inductance

—

2.0

—

LS

Internal Source Inductance

—

6.5

—

Ciss

Input Capacitance

—

4000

—

VGS = 0V, VDS = 25V

Coss

Output Capacitance

—

330

—

f = 1.0 MHz

Crss

ReverseTransfer Capacitance

—

52

—

IRHN7450SE Device

Pre-Radiation



µA

nC

pF

nH

ns

Measured from the

drain lead, 6mm (0.25

in.) from package to

center of die.

Measured from the

source lead, 6mm

(0.25 in.) from package

to source bonding pad.

Modified MOSFET

symbol showing the

internal inductances.

nA

A

K/W

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